| 摘要 |
PROBLEM TO BE SOLVED: To provide a board mounting technique such that high-density packaging of a module can be achieved while the influence of the reflection of signals caused by the branching of a transmission line is suppressed. SOLUTION: When an SSTL is used as the standard of a high speed interface, a series resistance 14 that was conventionally mounted on the surface of a module is provided inside a connector 71, and a conductive connector pin 13 and board wires 20 , 21 are connected to the series resistance 14. The series resistance 14 serves to inhibit the reflection of signals caused by the branching of a transmission line, and since the series resistance does not need to be mounted on the surface of the module as it is in conventional cases, high-density packaging of a module 101 can be achieved. |
