| 摘要 |
PROBLEM TO BE SOLVED: To provide a means for inexpensively evaluating the electric characteristics of an electric circuit packaged on multi-layer substrate structure by using highly accurate and efficient simulation. SOLUTION: When an inductor component Lfeed 4 is added to an electric equavalent circuit(EEC) model 3 for a parallel plate built in a multi-layer substrate and an EEC model 2 for a through hole with respect to an EEC model for the multi-layer substrate having the metallic parallel plate and the metallic through hole, feeding point inductance generated due to the connection of the parallel plate to the through hole is modeled to efficiently improve the accuracy of the multi-layer substrate EEC model. An error in the resonance frequency of the electric circuit model is set up and the minimum scale and effective frequency range of the electric circuit model are determined, so that the calculation efficiency of simultation based on the multi-layer substrate EEC model can be improved. |
