发明名称 BONDING METHOD FOR SOLID LASER OSCILLATOR
摘要 PROBLEM TO BE SOLVED: To raise the output as compared with a conventional bonding method. SOLUTION: A laser diode 23, a solid laser oscillator 26 fitted with a reflecting surface, and an output mirror 28 are bonded to a substrate 2. To begin with, the laser diode 23 is fixed to the substrate 2, and the light radiated by the light emission of the laser diode 23 is measured with a measuring device 18, and the measuring device is positioned in the position where the maximum output is obtained. Next, in the condition that the laser diode 23 emits light, the output of the light having passed a solid laser oscillating element 26 fitted with a reflecting face is measured with the measuring device 18, and the element 26 is fixed in the position where the maximum output is obtained. Furthermore, the laser diode 23 is made to emit light to excite the element 26, and resonate light between the reflecting face and an output mirror 28. Then, the output of the laser beam of the element 26 having passed the output mirror 28 is measured with the measuring device 18, and the output mirror is fixed in the position where the maximum output is obtained.
申请公布号 JPH10303481(A) 申请公布日期 1998.11.13
申请号 JP19970121598 申请日期 1997.04.24
申请人 SHIBUYA KOGYO CO LTD 发明人 KOSEKI RYOJI
分类号 H01S3/02;H01S3/094;H01S3/16;(IPC1-7):H01S3/02 主分类号 H01S3/02
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