INTERCONNECTION BOARD, MULTILAYER INTERCONNECTION BOARD AND THEIR MANUFACTURE

摘要

PROBLEM TO BE SOLVED: To change the pitches of both the end surfaces of a plurality of metal wiring elements which function as via the metal wiring unit between both the surfaces of an insulating layer and increase the degree of freedom of the arrangement of drawn out wirings by a method wherein angles between the metal wiring units and the flat surface of the insulating layer are different between the respective rows of the metal wiring elements. SOLUTION: A plurality of metal wiring elements 14 are made to pierce through a plate-type insulating layer 12 in its thicknesswise direction and arranged so as to have their end surfaces 14a and 14b exposed on both the surfaces of the insulating layer 12. In this arrangement, angles between the metal wiring elements and the flat surface of the insulating layer 12 are different between the respective rows of the metal wiring elements 14. With this constitution, the arrangements of the end surfaces 14a and 14b of the metal wiring elements 14 are changed between the front and rear of an interconnection board 10 to increase the degree of freedom of the arrangement of interconnection on the rear and a wiring which utilizes a space efficiently with the high wiring efficiency can be obtained. Further, as the wirings can be easily led out with a small number of board layers, the number of connection terminals for a specified area can be increased.