TAPE CARRIER FOR SEMICONDUCTOR COMPONENT MOUNTING AND SEMICONDUCTOR DEVICE WHEREIN THE TAPE CARRIER IS USED

摘要

PROBLEM TO BE SOLVED: To connect an inner lead and a mounted semiconductor component by a wire bonding method based on a thermosonic wire bonding method by providing an inner lead with a foundation plating layer with specified hardness and specified thermal diffusion resistance and a gold plating layer formed thereon. SOLUTION: A lead 2 with an inner lead 2a and an outer lead 2b is bonded on a polyimide tape 1 through heat resistant adhesive 7. The lead 2 is coated with a nickel-phosphorus foundation plating layer 3 and a gold plating layer 4, for example. The plating layers are provided to a connection surface with a bonding wire of the inner lead 2a. The foundation plating layer 3 has specified hardness required for ultrasonic bonding and specified thermal diffusion resistance required for thermocompression bonding. The gold plating layer 4 is formed on the foundation plating layer 3. The inner lead 2a and a mounted semiconductor element can be bonded in this way.