SEMICONDUCTOR INSPECTING DEVICE

摘要

PROBLEM TO BE SOLVED: To take the image of an intended wide ranged area on an object with a high resolution only by a lighting means to the object by providing the image of a semiconductor chip of the object by use of a lens, and switching the object visual field by an optical axis deflection switching means. SOLUTION: In the measurement of a semiconductor chip 1 in one field of view, X, Y-directional galvano-mirrors 15a, 15b are driven and positioned so that the optical axes are coincident to a reference position. An image is formed on an X-directional CCD line sensor 16a through an objective lens 17, the galvano-mirrors 15a, 15b, a half mirror 22, an imaging lens 18, and an optical axis branching mirror group 23. In case of an X-axially long image, the galvano-mirror Y15b is driven without using a Y-directional line sensor 16b to form a two-dimensional image data in an image processing unit 25. In the measurement of the chip in the other field of view, the galvano-mirrors 15a, 15b are driven and positioned to form the image on the Y-directional line sensor 16b. In case of a Y-axially long image, the galvano-mirror X15a is driven without using the X-directional line sensor 16a.