MANUFACTURE FOR PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To form a printed board with a small warpage by sandwiching between boards at least one prepreg having through openings for forming hollow spaces at the positions corresponding to the parts where the boards are opposed to each other when thermosetting resin is heated and pressed and is fluidized. SOLUTION: A first board 11a, a second board 11b and a prepreg 20 sandwiched therebetween are laminated such that a conductive pattern 14 having cured resin 15 buried in the spaces touches the prepreg 20 and then the prepreg 20 is heated and pressed to fluidize and cure the thermosetting resin in the prepreg 20. This integrates the first board 11a, the second board 11b and the prepreg 20 and forms hollow spaces 25 therein. The part of the board corresponding to the hollow spaces 25 are hard to shrink and hence the absolute amount of the shrinkage of the first board 11a and that of the second board 11b become small and the difference between them also becomes small, which can form a printed board with a small warpage.