发明名称 COOING DEVICE OF CIRCUIT MODULE AND PORTABLE INFORMATION EQUIPMENT MOUNTING CIRCUIT MODULE
摘要 <p>PROBLEM TO BE SOLVED: To provide a cooling device of a circuit module that fully secures the cooling performance of a circuit element, at the same time, compactly forms a cooling member including a fan unit, and can reduce the occupation area of the cooling member for a circuit board. SOLUTION: A circuit module 19 has a circuit board 20 with a reverse side 20a and a surface 20b, a TCP(tape carrier package) 25 that is packaged to the reverse side of the circuit board, a heat reception part 37 for escaping the heat of the TCP in the direction of the surface of the circuit board, a cold plate 35 that is arranged on the surface of the circuit board and receives the heat of the TCP via the heat reception part, and a fan unit 55 with a rotor 57 and a fan case 58 for accommodating the rotor. The fan case 58 is in contact with a cold plate 35 in a posture for arranging the rotary shaft of the rotor along the thickness direction of the circuit board and has a channel path 64 where a cool wind is circulated when the rotor 57 rotates.</p>
申请公布号 JPH10303582(A) 申请公布日期 1998.11.13
申请号 JP19970104746 申请日期 1997.04.22
申请人 TOSHIBA CORP 发明人 TOMIOKA KENTARO
分类号 G06F1/20;H01L23/36;H01L23/467;H05K7/20;(IPC1-7):H05K7/20 主分类号 G06F1/20
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