发明名称 LOW DENSITY FILM FOR LOW DIELECTRIC CONSTANT APPLICATIONS
摘要 A film having a dielectric constant of less than 3 (most preferably less than 2) and comprising a layer of particles and a deposit on top of and within the particle layer, and a method of making same. The particles are agglomerated particles, hollow particles, porous particles, or a combination thereof. The film is substantially planar on its surface, and the film is substantially impermeable to gases. The method comprises coating a substrate with the particles (preferably spin-coating a colloidal solution); drying the particles to form a substantially uniform particle layer; depositing a deposit onto the particle layer (preferably by low pressure chemical vapor deposition and causing chemical vapor infiltration to bond the particles to the substrate); and optionally polishing/planarizing the deposit surface (preferably by chemical mechanical polishing).
申请公布号 WO9850945(A2) 申请公布日期 1998.11.12
申请号 WO1998US09295 申请日期 1998.05.06
申请人 SKAMSER, DANIEL, J.;KODAS, TOIVO, T.;HAMPDEN-SMITH, MARK, J. 发明人 SKAMSER, DANIEL, J.;KODAS, TOIVO, T.;HAMPDEN-SMITH, MARK, J.
分类号 C03C17/00;C08K7/24;C08K7/26;H01L21/316 主分类号 C03C17/00
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