Multi-layer electric circuit board

摘要

The circuit board (11) has a number of successive ceramics layers (11a-11d), with a conductor pattern (12b,12c) applied to one side of alternating ceramics layers (11b,11d), both conductor patterns having corresponding high density conductor path sections. The outer surface of the uppermost ceramics layer (11a) may be used as a mounting surface for a flip-chip device (13), provided with electrode surfaces (12a) coupled to the terminals of the latter and connected to the underlying conductor pattern.