| 摘要 |
<p>Bump electrodes which are the outer connection terminals of a package are made of elastic material. The stress which is produced by the difference in thermal expansion coefficient between the package and a printed wiring board on which the package is mounted is absorbed by the elastic deformation of the bump electrodes. The preferable elasticity of the elastic material of which the bump electrodes are made is 0.00001 Gpa to 5 Gpa and, more preferably, 0.001 Gpa to 1 Gpa.</p> |
