METHOD FOR METALLIZING AT LEAST ONE PRINTED CIRCUIT BOARD OR AT LEAST ONE PRESSED SCREEN AND AT LEAST ONE HYBRID

摘要

The invention relates to a method for metallizing at least one printed circuit board and at least one pressed screen and at least one hybrid, comprising the following steps: forming contact elements using a metallizing foil; positioning said metallizing foil above the hybrid in such a way that the contact elements can be inserted into the places provided between the lead circuits of the hybrid and the lead circuits of the printed circuits board; and stripping at least part of the contact metallizing foil so as to enable, at least partly, access to said contact elements.