BALL GRID ARRAY SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME

摘要

Disclosed is a semiconductor package that includes a heat spreader (110). The package further includes a ground plane (160) having a first side that is attached to the heat spreader with an elctrically insulating adhesive (127). The ground plane has a first aperture (166a) defining a path to a surface of the heat spreader tthat is configured to receive a semiconductor die. An interconnect substrate (125) is adhesively attached to the ground plane, and the interconnect substrate has a second apperture (154) over the first aperture of the ground plane. Preferably, the interconnect substrate has a plurality of metal patterns (118) for electrically interconnecting the semiconductor die to electrical connections that are external to the package. The package further includes at least one conductively filled via (119) that is defined through the interconnect substrate and is in electrical contact with the ground plane. A second side of the ground plane includes patterned wettable pads over selected regions that are in electrical contact with at least one via.