发明名称 PREFORMS FOR MOULDING PROCESS AND RESINS THEREFOR
摘要 Binder coated fibres comprising from 80 to 99 % by weight reinforcing fibres and from 1 to 20 % by weight of a preform binder resin, said binder resin being in the form of particles or discrete areas on the surface of the reinforcing fibres, said binder resin comprising: from 40 to 90 % by weight of the binder resin of a thermosetting resin and from 10 to 60 % by weight of the binder resin of a high molecular weight engineering thermoplastic and/or an elastomer selected from vinyl addition polymer, fluororelastomers and polysiloxane elastomers, the engineering thermoplastic/elastomer being dissolved in the thermosetting resin, the binder resin being non-tacky at ambient temperature, having a softening point in the range 50 to 150 ~C and being heat curable at a temperature in the range 50 to 200 ~C.
申请公布号 CA2289083(A1) 申请公布日期 1998.11.12
申请号 CA19982289083 申请日期 1998.04.30
申请人 CYTEC TECHNOLOGY CORP. 发明人 MORTIMER, STEPHEN;COPPOCK, VINCENT
分类号 C08J5/06;B29B11/16;B29B15/10;B29C70/10;B29C70/48;D06M15/59;(IPC1-7):B29B11/16 主分类号 C08J5/06
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