| 摘要 |
<p>A seizure repairing material comprising 1 to 20 parts by weight of bisphenol or p-alkylphenol as a fluidization aid and 5 to 40 parts by weight of a material for hot forming carbon bonds per 100 parts by weight of a refractory material. The repairing material is excellent in hot spreadability, curability and bondability, provides good properties to a work, and improves durability of a seizure material. Moreover, the repairing material is free from changes with time such as solidification in summer, and sedimentation and separation for easy transportation and storage, is easy to handle and work, and enables a seizure work to be done within a short time. Therefore, it can be used effectively as a seizure repairing material for hot repairing various refining furnaces, molten metal containers, and so forth.</p> |
