发明名称 |
Brush for scrubbing semiconductor wafers |
摘要 |
<p>A tool for cleaning semiconductor wafers includes a cleaning head with a flat face bounded by an edge. A tubular drive shaft is connected to the cleaning head and provides a conduit through which a cleaning fluid can flow. An opening into the shaft is provided in the flat face which also has a plurality of channels to distribute the cleaning fluid across the flat face. A brush is formed as a single piece of porous, elastic material with a substrate portion that has a first major surface abutting the cleaning head face. A lip of the brush extends from the substrate portion around the edge of the flat face to removably secure the brush to the cleaning head. The brush has a plurality of cylindrical nubs on the second major surface forming projections for scrubbing surfaces of semiconductor wafers. <IMAGE></p> |
申请公布号 |
EP0876853(A2) |
申请公布日期 |
1998.11.11 |
申请号 |
EP19980302944 |
申请日期 |
1998.04.16 |
申请人 |
INTEGRATED PROCESS EQUIPMENT CORP. |
发明人 |
CHOFFAT, CHRISTOPHER C.;GRIFFIN, JUSTIN J. |
分类号 |
B08B1/04;B24D9/08;B24D13/14;H01L21/00;H01L21/304;(IPC1-7):B08B1/04 |
主分类号 |
B08B1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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