Method of fixing a chip module in a chip card

摘要

the method involves mounting the chip module (30) in a cavity (31) in a chip base body (20), making an adhesive joint between at least one module surface and the base body and applying a covering layer in a lamination process. The adhesive material (34) is introduced into the cavity in liquid or viscous form in dosed quantities. The lamination process simultaneously displaces the adhesive material in the base body. The adhesive material's hardening properties are matched to the lamination process so that the adhesive material is hardened by the end of the lamination process.