发明名称 |
Method and system for the deposition of a multi-layer film |
摘要 |
This invention provides a method and apparatus for depositing a two-layer structure, including an antireflective coating and a dielectric layer, without any intervening process steps, such as a cleaning step. The invention is capable of providing more accurate and easier fabrication of structures by reducing inaccuracies caused by the reflection and refraction of incident radiant energy within a photoresist layer used in the patterning of the dielectric layer. Additionally, the antireflective coating of the present invention may also serve as an etch stop layer during the patterning of a layer formed over the antireflective coating. <IMAGE> |
申请公布号 |
EP0877415(A2) |
申请公布日期 |
1998.11.11 |
申请号 |
EP19980107972 |
申请日期 |
1998.04.30 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
CHEUNG, DAVID;YAU, WAI-FAN;HUANG, JUDY H. |
分类号 |
H01L21/31;C23C16/52;H01L21/027;H01L21/768 |
主分类号 |
H01L21/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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