发明名称 Method and system for the deposition of a multi-layer film
摘要 This invention provides a method and apparatus for depositing a two-layer structure, including an antireflective coating and a dielectric layer, without any intervening process steps, such as a cleaning step. The invention is capable of providing more accurate and easier fabrication of structures by reducing inaccuracies caused by the reflection and refraction of incident radiant energy within a photoresist layer used in the patterning of the dielectric layer. Additionally, the antireflective coating of the present invention may also serve as an etch stop layer during the patterning of a layer formed over the antireflective coating. <IMAGE>
申请公布号 EP0877415(A2) 申请公布日期 1998.11.11
申请号 EP19980107972 申请日期 1998.04.30
申请人 APPLIED MATERIALS, INC. 发明人 CHEUNG, DAVID;YAU, WAI-FAN;HUANG, JUDY H.
分类号 H01L21/31;C23C16/52;H01L21/027;H01L21/768 主分类号 H01L21/31
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