Method of bonding silicon wafers,申请号EP19940203450-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	Method of bonding silicon wafers
摘要
申请公布号	EP0660117(B1)	申请公布日期	1998.11.11
申请号	EP19940203450	申请日期	1994.11.28
申请人	GENERAL MOTORS CORPORATION;DELCO ELECTRONICS CORPORATION	发明人	LEE, HAN-SHENG;CHILCOTT, DAN WESLEY;STALLER, STEVEN EDWARD
分类号	G01P15/08;(IPC1-7):G01P15/08	主分类号	G01P15/08
代理机构		代理人
主权项
地址

您可能感兴趣的专利

TRACK JUMP CONTROLLING DEVICE

DIGITAL SIGNAL REPRODUCING DEVICE

PUFFER-TYPE GAS CIRCUIT BREAKER

FRAMING METHOD IN DIGITAL VIDEO SIGNAL RECORDER

AUTOMATIC CARTRIDGE PULL-IN DEVICE IN DISK DRIVE DEVICE

STRUCTURAL BODY FOR PROBE, RECORDER, INFORMATION DETECTOR, REPRODUCING DEVICE AND RECORDING AND REPRODUCING DEVICE

OPTICAL DISK PLAYER

INFORMATION RECORDING/REPRODUCING DEVICE

MAGNETIC RECORDING MEDIUM

MAGNETO-RESISTANCE EFFECT TYPE HEAD

MAGNETIC HEAD UNIT

CHARACTER READER

BRAKE MECHANISM

OPTICAL RECORDING MEDIUM AND TRACKING SERVO CIRCUIT

METHOD FOR MEASURING CHARACTERISTIC OF MAGNETIC HEAD

APPARATUS FOR PRODUCING POWDER MOLDING, SUCH AS FIXING FRAME FOR MAGNETIC HEAD AND PRODUCTION OF THE SAME

MAGNETIC TAPE RECORDING AND/OR REPRODUCING DEVICE

RADIO WAVE-TYPE BURGLAR PREVENTION DETECTOR