| 摘要 |
PCT No. PCT/JP96/03156 Sec. 371 Date Jun. 17, 1997 Sec. 102(e) Date Jun. 17, 1997 PCT Filed Oct. 28, 1996 PCT Pub. No. WO97/19136 PCT Pub. Date May 29, 1997A molding compound composition of the present invention comprises a resin composition, for example, unsaturated polyester, a succinic acid derivative, and a thickening agent such as magnesium oxide, and the moisture content thereof is adjusted in a range of from 0.1 to 0.45 percent by weight. A molding compound comprises the molding compound composition and reinforced fibers such as glass fibers, and the moisture content thereof is adjusted to be in a range of from 0.1 percent to 0.4 percent by weight. As shown in FIG. 1, the molding compound composition has excellent viscosity characteristics since the initial thickening action due to the thickering agent is restrained. Although the viscosity after thickened is lower than that of a conventional composition, the stickiness of the surface of the molding compound composition is reduced. The molding compound composition has high flowability and excellent impregnability, shows an abrupt viscosity increase after impregnation, and is thickened at higher speeds as compared with the conventional composition.
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