发明名称 |
Cooler for removing heat from a heated region |
摘要 |
A cooler features a plurality of microchannels each of which includes a plurality of baffles disposed therein to avoid laminar flow within each microchannel through modulation which varies both the direction and velocity of fluid flowing through each microchannel. The microchannels are formed between a plurality of spaced apart thermally conductive fins, which are arranged to extend from a thermally conductive substrate adapted to be in physical contact with a region to be cooled. The fins are formed by stacking a plurality of thin sheets along a direction transverse to a longitudinal axis of the microchannels. Each sheet includes a plurality of apertures spaced apart along two transverse directions, both of which are transverse to the stacking direction. The baffles are formed from the spaces disposed between the apertures. Preferably, each sheet is formed from copper which is chemically etched to form the apertures in the sheet.
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申请公布号 |
US5835345(A) |
申请公布日期 |
1998.11.10 |
申请号 |
US19960725118 |
申请日期 |
1996.10.02 |
申请人 |
SDL, INC. |
发明人 |
STASKUS, MICHAEL P.;HADEN, JAMES M. |
分类号 |
H01S5/024;H01S5/40;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H01S5/024 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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