| 摘要 |
An apparatus for modifying a printed circuit board comprised of a nonconductively adhering flexible circuitized substrate, the flexible circuitized substrate having a conductive circuit trace composed of one or more layers of thin wires sandwiched between two or more layers of flexible insulating protective material. The wires forming the circuit trace of the flexible substrate and the conductors forming the circuitry in and on the printed circuit board are electrically interconnected at appropriate predetermined positions by establishing conductive paths through portions of the insulating layers of the flexible circuitized substrate. Circuit components can also be affixed to either the flexible circuitized substrate or to the printed circuit board or to both after the flexible circuitized substrate has been affixed to the printed circuit board. By this means, additional or corrective electrical connections can be made to the printed circuit board at one time without the danger of routing errors or unwanted transmission effects of soldered wire interconnects. Additionally, circuit components of a differing bonding-pad configuration or pitch may be conveniently substituted for those originally designed to be used within the printed circuit board circuitry.
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