发明名称 |
Method of making multiple-bond shelf plastic package |
摘要 |
A method for forming a package for an integrated circuit in which a plurality of conduction paths are formed on a first board and on a second board. Holes are formed in the first board and the second board wherein the holes are adapted for receiving pins. The holes are aligned and the first board is coupled to the second board using an adhesive.
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申请公布号 |
US5832596(A) |
申请公布日期 |
1998.11.10 |
申请号 |
US19960777635 |
申请日期 |
1996.12.31 |
申请人 |
STMICROELECTRONICS, INC. |
发明人 |
CHIU, ANTHONY MAN-CHONG |
分类号 |
H01L21/60;H01L23/08;H01L23/12;H01L23/498;H01L23/50;(IPC1-7):H05K3/36 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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