发明名称 METHOD AND DEVICE FOR RESIN MOLDING USING RELEASE FILM
摘要 PROBLEM TO BE SOLVED: To provide a resin mold using wrapping resin in a resin molding method for coating almost the whole surface of a parting face including a pot using a release film. SOLUTION: In a resin molding method, a parting face for molding dies 30a and 30b including a port 12, a cull and a cavity recessed section 14 is all coated with a release film 10, and resin for molding is fed into the pot, and a product to be molded 16 is clamped, and resin is filled in the cavity for resin molding. In that case, the parting face is coated with the release film 10, and then a cut is formed on a site blocking the pot 12 by the release film 10 prior to the operation of feeding resin for molding into the pot 12, and a stick-shaped wrapping resin 60 sealed with the wrapping resin is fed from the cut into the pot 12 and resin molded.
申请公布号 JPH10296778(A) 申请公布日期 1998.11.10
申请号 JP19970105551 申请日期 1997.04.23
申请人 APIC YAMADA KK 发明人 MIYAJIMA FUMIO;MORI SHUJI;AOKI KUNIHIRO;NISHIZAWA TETSUYA
分类号 B29C33/68;B29C45/02;B29C45/14;B29C45/26;B29K105/20;B29L31/34;H01L21/56;(IPC1-7):B29C45/02 主分类号 B29C33/68
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