发明名称 METHOD FOR RECOVERING AND GRANULATING WASTE RESIN MOLDED PRODUCT
摘要 <p>PROBLEM TO BE SOLVED: To separate, recover, and reuse metal materials and resin materials from printed substrates. SOLUTION: Electronic parts such as capacitors are dropped by heating printed substrates, respective parts are separately and roughly pulverized into small pieces to be treated, the roughly pulverized small pieces to be treated are crushed by applying compressive impact force based on fine vibration to finely crush resin materials and at the same time to metal materials are rolled to be thin and to part the resin materials and the metal materials, and then both resin materials and metal materials are sorted by sieving to recover those materials separately. As a post treatment of the sieving separation, air blowing sorting, magnetic sorting, and gravity concentration sorting are effective.</p>
申请公布号 JPH10296225(A) 申请公布日期 1998.11.10
申请号 JP19970109332 申请日期 1997.04.25
申请人 AIN KOSAN KK 发明人 NISHIBORI SADAO
分类号 B09B5/00;B07B9/00;B29B13/10;B29B17/00;B29B17/04;B29K105/26;H05K3/22;(IPC1-7):B09B5/00 主分类号 B09B5/00
代理机构 代理人
主权项
地址