发明名称 Printed circuit board-mounted, sealed heat exchanger
摘要 A housing structure for retaining and cooling a plurality of printed circuit boards includes an arrangement of parallel electrical connectors, which receive associated connectors mounted to respective ones of the printed circuit boards. Integrated with each printed circuit board is a respective frame-configured thermally conductive heat exchanger, that abuts a first side of the printed circuit board. A second side of the printed circuit board contains circuit components to be cooled. Cooling fluid flowing through the adjacent chambers of the heat exchanger draws heat away from the circuit components. A cooling fluid supply and removal plenum is coupled to adjacent fluid inlet and exhaust ports provided at a top end wall of the heat exchanger. Mounting the printed circuit components on the side of the printed circuit board opposite to that to which the heat exchanger is affixed isolates the circuit components from the heat exchanger and thereby prevents the circuit components from being exposed to any potentially corrosive foreign matter that may be present in the cooling fluid flowing through the heat exchanger. In addition, affixing the heat exchanger directly to the printed circuit board increases the flexure stiffness of the circuit board structure.
申请公布号 US5835349(A) 申请公布日期 1998.11.10
申请号 US19970873677 申请日期 1997.06.12
申请人 HARRIS CORPORATION 发明人 GIANNATTO, CARL J.;CORNISH, KEVIN C.;STRAUB, WALTER H.
分类号 H05K7/14;H05K7/20;(IPC1-7):H05K7/20 主分类号 H05K7/14
代理机构 代理人
主权项
地址