| 摘要 |
Method and apparatus for conditioning a polishing pad. In particular, a check loop system and associated code are described for monitoring force applied on a pad from an end effector attached to an arm. The pad is conditioned by the end effector for mechanical polishing to remove matter from a substrate assembly. This may be done with chemical-mechanical-polishing and is often used for planarization of a substrate assembly. Described are a modular turret and drive system which are used to manipulate an end effector over a pad.
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