| 摘要 |
<p>PROBLEM TO BE SOLVED: To secure the desired coating quantity of die bond paste, to mount semiconductor chips with desired accuracy and to improve the reliability of parts. SOLUTION: In this device, while a nozzle 17 for discharging die bond paste 6 is made to approach a lead frame, the nozzle 17 is pressurized to discharge the die bond paste 6 from the nozzle 17 and is stuck on the lead frame. Then, the nozzle 17 is separated from the lead frame and while keeping a state in which the lead frame and the nozzle 17 are connected, the die bond paste 16 is extended. Then, the nozzle 17 is evacuated to suck the die bond paste 6 from the nozzle 17 and cut it. Then, furthermore, the nozzle 17 is separated from the lead frame. In this way, when the die bond paste 6 is applied, the desired coating quantity and the coating form are secured and the time that elapses before cutting can be shortened.</p> |
