| 摘要 |
<p>PROBLEM TO BE SOLVED: To realize an economical cutting-off under enough strength by a method wherein this band saw is equipped with a saw band piece, which turns through a pully device and has cutting blades with cutting covers on the opposite side of the back part of the band piece, and a feeding device, which moves a work piece relative to the cutting blades, so as to pass the saw band piece having supporting plates at the back part of the band piece through the work piece in order to form a cutting gap. SOLUTION: The saw band piece 2 of a bond saw turns through three deflecting pulleys 3. The band saw is equipped with guides 6 and 7, between which the saw band piece 2 runs. Since the saw band piece 2 can be influenced by the action of the flow of water and/or air, a feeding duct having outlet openings directing to the direction of the saw band piece 2 is equipped in the jaw part of each guide so as to change the position of the band piece in order to correct the passage of the band piece when the deviation of the band piece from the recorded planned cutting passage is detected with a sensor. The band saw is equipped with a feeding device 8, on which a cylindrical work piece 9 is mounted vertically, so as to linearly guide the work piece 9 toward s the cutting blade of the saw band piece 2. A wafer holder 10 joins onto thw work piece 9 by means of vacuum action so as to realize the accurate cutting off of a wafer at economically high feeding rate.</p> |
