The chip module (4) is enclosed in a cavity (3) in a plastic carrier (2) and includes an integrated circuit (5) with lead wires (6) to a contact surface (7) divided into pads. Among the pads a circular recess (8) is formed to be filled with an insulating layer (9) which extends to the edges (10) and through the centre (11). An intermediate supporting layer (12) optionally is provided between the surface and the layer, with holes (13) for the lead wires. The insulating layer produces no unwanted bridging in the vicinity of the contact surface. The intermediate layer, if any, is of glass fibre reinforced plastic for strengthening of the card.
