发明名称 MONITORING OF MINIMUM FEATURES ON A SUBSTRATE
摘要 <p>A method of measuring bias of a minimum feature in a lithographic process uses creating an array of elements having a width (wp) and space corresponding to the minimum feature, and a length (lp). The length change of the array element resulting from image shortening effect from a lithographic process is measured and the bias of the element in the width dimension is calculated. A test site having groups of array (44) elements is described which facilitates automatic bias measurement of array lengths and separations and especially allows the use of non SEM metrology tools which is otherwise incapable of measuring the minimum feature width being monitored. Measurements by this method and test site used to control lithographic processing of substrates (42) in manufacturing, routine monitoring of product substrates and lithographic tool and process for minimum bias, are disclosed.</p>
申请公布号 WO1998049538(A1) 申请公布日期 1998.11.05
申请号 US1997006968 申请日期 1997.04.25
申请人 发明人
分类号 主分类号
代理机构 代理人
主权项
地址