| 摘要 |
PROBLEM TO BE SOLVED: To restrain generation of undulation caused by shortage of slurry by a method wherein the shortage of the slurry on a cutting surface between a semiconductor ingot and a wire is eliminated in a slicing device of a semiconductor ingot. SOLUTION: In a slicing device of a semiconductor ingot b which executes slice cutting of a wafer by travelling a wire 5 feeding a slurry containing a cutting material to a cutting surface 13 between the wire 5 and a semiconductor ingot (b) by pushing the semiconductor ingot (b) onto the wire 5 helically wound between a plurality of roller's 2, 3, a first slurry feed means 14 feeding the slurry to a wire incident position side to the ingot facing the cutting surface 13 between the semiconductor ingot (b) and the wire 5, and a second slurry feed means 15 feeding the slurry at an upper-stream side position in a running direction of the wire 5 in a direction of being further separated from the ingot (b) from the first slurry feed means 14, are provided. By improvement of a feed form of the slurry to a depth of the cut thereby, generation of undulation caused by shortage of the slurry is controlled. |
