| 摘要 |
PROBLEM TO BE SOLVED: To increase the number of processing units without augmenting the occupation floor area of a wafer processing apparatus and to enable an efficient processing of wafer by a method wherein a cluster arrangement system of a first wafer processing unit and a parallel arrangement system of a second wafer processing unit are arranged in the vertical directions and the wafer are delivered between the first and second wafer processing units via delivery units. SOLUTION: A wafer processing unit has a first wafer transfer mechanism 12 provided with one pair of upper and lower wafer transfer arms 11a and 11b, a spin coater 13 and a sping developer 14, which are provided in such a way as to encircle the mechanism 12, and a first wafer processing unit 10 having one pair of placement stages and the processing apparatus has a second wafer transfer mechanism 22 provided with one pair of upper and lower wafer transfer arms 21a and 21b, heating units 23 provided along a transfer path 25 of the mechanism 22 and a second transfer unit 20 having a deffusion units 24. Moreover, the processing apparatus has cooling units 30 for delivering wafer between the mechanisms 12 and 22. |
