| 摘要 |
PROBLEM TO BE SOLVED: To provide the semiconductor device, which can obtain highly reliable wire bonding for an electrode comprising a cylindrical metal rod. SOLUTION: With respect to a cylindrical electrode 6A, a point A, where the central line along the driving direction of the bonding tool of a wire bonding device and circumference of the line cross, is made to be the reference. The position, which is deviated by the dimension of about 1/2 of the radius of the electrode 6A along the direction perpendicular to the above described central line from here, is made to be a bonding central position B. Thus, a bonding wire 9A is bonded. The bonding strength is high, and the highly reliable wire bonding can be realized. Furthermore, at the time of the wire bonding, the position, which is displaced in the direction perpendicular to the bonding direction of the electrode, is recognized, and the bonding is performed. The conventional recognizing method of the bonding position can be utilized intactly. The easy wire bonding can be realized without using special controlling software. |
