| 摘要 |
PROBLEM TO BE SOLVED: To provide a mold device and a molding method using the mold device for making the solidifying speed for a base constant by uniformizing the temperature of a fixed mold and a movable mold. SOLUTION: A mold device is provided at least with a first cooling means 12 disposed inside a section on which one main face of the base is molded by a fixed mold 1, a second cooling means 13 formed in a manner of encircling a sprue bush 5 and first heat insulated layers 16A and 16B formed at least on a part between the first cooling means 12 and the second cooling means 13, and the movable mold 2 is provided with a third cooling means 14 provided inside a section forming the other main face of the base, a fourth cooling means 15 provided almost on the center of the base and a second heat insulated layer 17 formed at least between the third cooling means 14 and the fourth cooling means 15. |
