| 摘要 |
PROBLEM TO BE SOLVED: To prevent the generation of an improper short circuit of wires due to the sag of the wires or the like by a method wherein a mesh-shaped frame consisting of an insulating member is installed on the whole surface of a semiconductor chip mounted on a substrate in such a way as to cover the whole semiconductor chip and the wires are inserted in holes formed in a mesh shape in the frame to connect electrically electrode parts on the element with external electrode parts. SOLUTION: The whole surface of a semiconductor chip 2 is covered with a mesh-shaped frame 6 consisting of an insulator. This frame 6 is formed into a structure, wherein the frame 6 is formed into a box type shape, has a width wider than that of the chip 2 and a length longer than that of the chip 2 and has a height higher than that of the chip 2, and the upper surface of the frame 6 is formed into a structure, wherein the upper surface is formed into a mesh shape. Moreover, the chip 2 and external electrodes 3 are wire-bonded to each other by wires 4 and 8 through holes formed in the frame 6. Accordingly, even if the distance from electrode parts on the chip 2 to the electrodes 3 is a distance of 0.3 mm or longer, which is regarded as the limit of the distance, an improper shorticircuit of wire loops due to contact of the wire loops with the end parts of the chip 2 due to the slack, sag or the like of the wire loops and shortcircuit defect of the wires due to contact of the fellow wires 4 and 5 can be prevented from being generated. |
