发明名称 SHEET-FORM HEAT CONDUCTIVE STRUCTURE
摘要 PROBLEM TO BE SOLVED: To realize a heat transfer structure having a comparatively good heat conductivity by providing a sheet structure of a cloth made by weaving a metallic wire with a good heat conductivity and an elastic body which presses the wire in the vertical direction. SOLUTION: A heat transfer sheet structure body 20 for heat transfer of semiconductor packages 51 and 52 and of a heat transfer plate 80 is a sheet structure body made of a structure in which an elastic body 21 and a metallic wire 22 are woven. The construction body 20 is sandwiched between the semiconductor packages 51 and 52 having different heights and the heat transfer plate 80. Then the metallic wire 22 which is exposed from the upper surface caused by the elasticity of the elastic body 21 is pressed to the heat transfer plate 80 and the metallic wire 22 which is exposed from the lower surface is pressed to the surfaces of the semiconductor packages 51 and 52. The cloth whose mesh is small is contacted at many points or curved surfaces. As a result a heat transfer structure having a comparatively good heat transfer can be realized.
申请公布号 JPH10294407(A) 申请公布日期 1998.11.04
申请号 JP19970103290 申请日期 1997.04.21
申请人 ADVANTEST CORP 发明人 SUGAI KATSUSHI;SEKINO TAKASHI;SHIROYAMA KOICHI;OKUDA TAKASHI
分类号 H01L23/36;(IPC1-7):H01L23/36 主分类号 H01L23/36
代理机构 代理人
主权项
地址