| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce production costs by facilitating the mutual positioning and soldering of carrier and ferrite substrate when providing an isolator mount. SOLUTION: A jig for soldering and mounting to be used when soldering a ferrite substrate 2 of isolator and a chip resistor 5 onto the carrier is composed of a jig base 20 having a recess for housing and positioning a carrier 1 on its upper surface while being formed from a material which improves heat conductivity and is hardly soldered, and a jig plate 30, which has an opening part for housing and positioning the ferrite substrate 2 at its central part and forms a notched part 35 for forming a solder pool continuously to the set section of chip resistor 5 at its opening peripheral part, formed from a material, which is hardly soldered, and overlapped onto the jig base 20 while being mutually positioned through position engaging elements 25, 31 and 32.</p> |
