| 摘要 |
PROBLEM TO BE SOLVED: To set an angle formed by an orientation flat and an axis of easy magnetization of a magnetic film at a desired value by unloading a wafer inside a cassette which is rotated by a specified angle and mounting a wafer on a wafer stage so that a contact inner wall surface of a cassette and an orientation flat form a specified angle. SOLUTION: A cassette is held in a specified direction. That is, when a wafer is mounted on a wafer stage by a robot, it is held in a direction wherein an angle formed by an orientation flat and an applied magnetic field direction becomes 0 deg.. Then, a cassette is rotated by a specified angleθaround a wafer central axis 19 inside a cassette and stopped by a cassette stage 25. Then, a wafer 18 is mounted on an arm by a robot and is unloaded, and mounted on a wafer stage of a sputter chamber. Thereby, a wafer is mounted on a wafer stage so that an angle formed by an orientation flat 17 of the wafer 18 and an applied magnetic field direction becomesθ.
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