摘要 |
PROBLEM TO BE SOLVED: To mount external terminals on a memory card at a high packing density by reducing the mounting spaces of the terminals. SOLUTION: Memories 4 and 5 are adjacently mounted on a memory card and external terminals 4a2 , 4b2 , 5a2 , and 5b2 protruded from one side face of a package are arranged at narrow pitches, with external terminals 4a1 , 4b1 , 5a1 , and 5b1 protruded from the other side face of the package being arranged at pitches which are twice as wide as the arranging pitches of, for example, the terminals 4a2 and 4b2 . The memories 4 and 5 are mounted on the memory card in such a way that the memory 5 is put on the memory 4 so that the wide-pitch terminals 5a1 of the memory 5 protruded from the other side of the package may not come into contact with the wide-pitch terminals 4a1 of the memory 4 protruded from the same side of the package, namely, the memory 5 is turned against the memory 4 by 180 deg. when the memory 5 is put on the memory 4.
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