| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for printing for forming a wiring pattern or bump on a board by a low cost and high productivity by using paste or melted metal, method and apparatus for forming the bump or pattern, the bump electrode and printed circuit board. SOLUTION: The method for printing by an intaglio comprises the steps of dipping the intaglio 5 having a recess 6 as a printing shape in paste or melted metal 3 to charge the paste or the metal in the recess 6, sliding a surface in contact with the intaglio 5 while bringing a flat shield plate 8 into close contact with the intaglio 5, shielding the recess 6 opening surface while removing the paste or metal of the surface of the intaglio 5, bringing the plate 8 into contact with the surface of the intaglio 5, then taking out the intaglio 5 in close contact with the plate 8 from the paste or melted metal 3, then releasing the plate 8 from the intaglio 5, bringing the intaglio 5 into close contact with a material 10 to be printed, then separating the intaglio 5 from the material 10, and transferring the paste or metal onto the material 10.</p> |
