| 摘要 |
PROBLEM TO BE SOLVED: To provide a motor where the packaging structure of each component is improved by utilizing the use of d metal substrate as a motor substrate for forming the motor in a unit, its cost is reduced, and at the same time its cooling property is improved. SOLUTION: A bare-chip-type semiconductor chip 5 is directly packaged directly to an extended part that deviates from a rotor out of a metal substrate 9, by utilizing the use of the metal substrate 9 as a circuit substrate for mounting the motor and is sealed directly by a resin R. A recess and projection for expanding a surface region are formed around the packaging region of the semiconductor chip 5 in the metal substrate 9, a cooling area is increased, and at the same time a recessed part for positioning the semiconductor chip 5 is formed. |
