发明名称 INTEGRATED CIRCUIT DEVICE AND MANUFACTURE THEREOF
摘要 PROBLEM TO BE SOLVED: To dissipate heat generated from a pellet well and to prevent intrusion of moisture into the pellet from the outside by exposing at least the lower surface at a part of two sides of an island bend downward to the outside from a part of two sides of a resin package. SOLUTION: A recess 34 is made in the upper surface at a part of two sides of a substantially rectangular resin package 32 from where a signal terminal is not projecting and the upper surface of the part of two sides of a substantially rectangular island 35, i.e., the opposite end parts 36, is exposed to the position of the recess 34. Since the island 35 has the opposite end parts 36 being bent downward with respect to the central part 37, the lower surface at the opposite end parts 36 is exposed to the lower surface of the resin package 32 but the central part 37 is not exposed thereto but located on the inside. The island 35 is formed into an arc having low opposite end parts 36 and high central part 37 for mounting a pellet 3. According to the structure, heat generated from the pellet 3 can be dissipated well.
申请公布号 JPH10294415(A) 申请公布日期 1998.11.04
申请号 JP19970100328 申请日期 1997.04.17
申请人 NEC CORP 发明人 ICHIKAWA SEIJI;KITAKOGA TORU;UMEMOTO TAKESHI;NISHIBE TOSHIAKI;SATO KAZUNARI;TSUBOTA KUNIHIKO;SEI MASAHITO;NISHIMURA ZENICHI;OKAHIRA KEITA;MIYA TATSUYA;TAWARA KAZUHIRO
分类号 H01L23/50;H01L21/56;H01L23/31;H01L23/495 主分类号 H01L23/50
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