SEMICONDUCTOR DEVICE, LEAD FRAME, AND MANUFACTURE OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To bring the planar dimension of a sealed type semiconductor device nearer to those of a semiconductor chip and, at the same time, to secure the moisture resistance of the device by maintaining bonding strengths between leads and bumps when the semiconductor chip is bonded to a lead frame by using the bumps. SOLUTION: A plurality of L-shaped leads 10 is arranged so that their chip mounting sections 102 may become parallel to the center line of a semiconductor device in the longitudinal direction and the leads 10 arranged on the same side are arranged so that their chip mounting section 102 may be faced oppositely to each other in the same plane. The lead main body section 101 of each lead 10 has a bent section 103 which is bent in a projecting step-like shape when viewed from the side at a part near the chip mounting section 102 and the lead route to each bump from the front end of each lead main body section is bent in the X-, Y-, and Z-directions. A semiconductor chip 20 is mounted on the upper surface of the front end section of each chip mounting section 102 through bumps 30 and sealed with a molding material 40 including the bent sections 103.