发明名称 |
Device for correcting lateral bending of ic leads. |
摘要 |
A device for correcting the lateral bending of IC leads including a mold having comb-shaped pawls which are inserted into respective gaps between IC leads, wherein each of the comb-shaped pawls of the mold includes a contact member which is contacted with only the end portion of each IC lead, the end portions of the IC leads being pushed and spread out in a lateral direction by the contact members of the pawls when the pawls of the mold are inserted into the gaps. Each of the contact members is designed in a wedge shape. |
申请公布号 |
PH31517(A) |
申请公布日期 |
1998.11.03 |
申请号 |
PH19720000472 |
申请日期 |
1993.11.16 |
申请人 |
SANYO SILICON ELECTRONICS CO. LTD. |
发明人 |
WAKABAYASHI TAKAAKI;VENO TOMIO;VENO HATSUE |
分类号 |
B21D3/10;H01L23/50;H05K13/00 |
主分类号 |
B21D3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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