Process for fabricating electronic circuits with anodically oxidized scandium doped aluminum wiring

摘要

A process for fabricating an electronic circuit by oxidizing the surroundings of a metallic interconnection such as of aluminum, tantalum, and titanium, wherein anodic oxidation is effected at a temperature not higher than room temperature, preferably, at 10 DEG C. or lower, and more preferably, at 0 DEG C. or lower. The surface oxidation rate of a metallic interconnection can be maintained constant to provide a surface free of irregularities.