发明名称 Method and apparatus for reactive plasma surfacing
摘要 A method and apparatus for reactive plasma surfacing includes at least two electrodes between which reactive gases are passed. The reactive gases are ionized by the arc between the electrodes, creating a plasma of heated, ionized, reactive gases. The plasma is then applied to a surface to be treated, causing a chemical reaction between the plasma and the surface and resulting in a new diffusional substrate surface on the treated object. The process occurs at substantially atmospheric pressure, and may include an inert gas to shield the process from the surrounding environment.
申请公布号 US5830540(A) 申请公布日期 1998.11.03
申请号 US19960687265 申请日期 1996.07.25
申请人 ELTRON RESEARCH, INC. 发明人 BOWERS, JIM
分类号 C23C8/36;H05H1/24;(IPC1-7):H05H1/24;B05D1/02;C23C4/10;H01T14/00 主分类号 C23C8/36
代理机构 代理人
主权项
地址