发明名称 |
Polishing apparatus |
摘要 |
A polishing apparatus polishes a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a storage cassette for storing workpieces to be polished, at least two polishing units each having at least a turntable with a polishing cloth mounted thereon and a top ring for supporting a workpiece and pressing the workpiece against the polishing cloth, and a cleaning unit for cleaning a workpiece which has been polished by either one of the polishing units in such a state that the workpiece is removed from the top ring. The polishing apparatus further includes a transfer robot for transferring a workpiece between two of the storage cassette, the polishing units and the cleaning unit.
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申请公布号 |
US5830045(A) |
申请公布日期 |
1998.11.03 |
申请号 |
US19960697167 |
申请日期 |
1996.08.20 |
申请人 |
EBARA CORPORATION |
发明人 |
TOGAWA, TETSUJI;SAKURAI, KUNIHIKO;KIKUTA, RITSUO |
分类号 |
H01L21/304;B24B37/04;B24B51/00;B24B53/007;(IPC1-7):B24B7/22 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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