发明名称 |
Method of manufacturing probe card |
摘要 |
Bumps to be connected to inspection electrodes of semiconductor chips are formed on a surface of a flexible substrate. A plating layer is formed which is made of a harder material than the bumps formed on the flexible substrate and which has a concave portion or a convex portion whose diameter is equal to or smaller than half the diameter of the bumps, on a flat metallic plate. The plating layer of the metallic plate is pressed against top surfaces of the bumps, so that irregularities are formed in the top surfaces of the bumps.
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申请公布号 |
US5829126(A) |
申请公布日期 |
1998.11.03 |
申请号 |
US19960638038 |
申请日期 |
1996.04.26 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
NAGAO, KOICHI;NAKATA, YOSHIRO;OKI, SHINICHI |
分类号 |
G01R31/26;G01R1/067;G01R1/073;G01R3/00;H01L21/66;H05K3/40;H05K3/42;(IPC1-7):H01R9/00 |
主分类号 |
G01R31/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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