发明名称 Semiconductor device
摘要 Disclosed is a semiconductor device comprising an undoped GaAs layer, an intermediate undoped layer and an undoped Ga1-xAlxAs layer which are successively provided on a substrate made of a semiinsulating GaAs crystal; the intermediate undoped layer being an undoped InyGa1-yAs layer, an undoped GaAs1-zSbz layer, a superlattice layer which includes an undoped InyGa1-yAs layer and an undoped GaAs1-zSbz layer, a superlattice layer which includes an undoped InyGa1-yAs layer and an undoped GaAs layer, or a superlattice layer which includes an undoped GaAs1-zSb layer and an undoped GaAs layer. When applied to a high electron mobility transistor, this semiconductor device affords a high current and a high speed and has the merit of a small dispersion in the threshold voltage thereof.
申请公布号 US5831296(A) 申请公布日期 1998.11.03
申请号 US19940235155 申请日期 1994.04.28
申请人 HITACHI, LTD. 发明人 KURODA, TAKAO;SHIRAKI, YASUHIRO
分类号 H01L29/812;H01L21/20;H01L21/338;H01L29/201;H01L29/205;H01L29/778;H01L29/80;(IPC1-7):H01L29/778 主分类号 H01L29/812
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